I need a little insight from those of you in the fab end of the industry regarding an issue we have seen on a few incoming fabs. They are processed by the supplier using a horizontal HASL process, and we are finding random instances of partially or fully exposed copper on pads. Meaning, you may have one pad out of a row of a QFP pattern or one pad out of an entire BGA array that is bare copper even though all adjacent/surrounding pads are fully covered with HASL. Is this something inherent in the horizontal HASL process? If so, what is the phenomena that causes it? If not horizontal HASL processing, what are other potential causes? I have my ideas, but am looking for others. Enquiring minds want to know.... Mike McMonagle PCA Process Engineering Supervisor K*Tec Electronics 1111 Gillingham Lane Sugar Land, TX 77478 (281) 243-5639 Phone (281) 243-5539 Fax [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################