Steve,
I suppose it depends on what hill you are climbing. To some,
it may be tighter and tighter ball grids and similar types, to others it may
just be tighter or more dense surface mounts, perhaps focusing on internal
capacitors, etc etc. and to others it might be
exotic substrates, dielectrics and core
materials.
Your question cannot be answered by one direct sentence, as we
are all headed in diverse or unique directions as dictated
by one or more of the following:
(1) customer
(2) capability, both current and short term
future
(3) a specific company goal or mission
(4) resources or capital assets
(5) our individual and collective (customer/supplier)
knowledge and education.
As to what this company is doing at the moment,
we are listening to what works and what doesn't.
We receive this feedback
from customers, industry news, suppliers, etc etc.
What we see today, as mentioned in an earlier post, filled
vias for extremely dense (1.5 mil trace/space or less)
to allow our customers to get the most bang for the
buck.
Just a side note, these exchanges are some of the most
enlightening I have been involved in, thanks to all
you respondent.
Franklin
So who knows what's over the next hill?
It
doesn't start here completely, but we do add a few logs to the
fire.
Change is driven from the PCB side as well. What designer can
ignore pcb
manufacturing capabilities or technology development and
survive?
But....think of what it would be like with the opposite
condition.
Happy to be running after the technology
train,
Steve
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