Steve,

I suppose it depends on what hill you are climbing. To some, it may be tighter and tighter ball grids and similar types, to others it may just be tighter or more dense surface mounts, perhaps focusing on internal capacitors, etc etc. and to others it might be
exotic substrates, dielectrics and core materials.

Your question cannot be answered by one direct sentence, as we are all headed in diverse or unique directions as dictated
by one or more of the following:

(1) customer
(2) capability, both current and short term future
(3) a specific company goal or mission
(4) resources or capital assets
(5) our individual and collective (customer/supplier) knowledge and education.

As to what this company is doing at the moment, we are listening to what works and what doesn't. 
We receive this feedback from customers, industry news, suppliers, etc etc.

What we see today, as mentioned in an earlier post, filled vias for extremely dense (1.5 mil trace/space or less)
to allow our customers to get the most bang for the buck.

Just a side note, these exchanges are some of the most enlightening I have been involved in, thanks to all
you respondent.

Franklin

-----Original Message-----
From: Joy, Stephen C <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: 05 October, 1999 10:39 AM
Subject: Re: [TN] PCB Manufacturers; one comment


So who knows what's over the next hill?

It doesn't start here completely, but we do add a few logs to the fire.

Change is driven from the PCB side as well. What designer can ignore pcb
manufacturing capabilities or technology development and survive?

But....think of what it would be like with the opposite condition.

Happy to be running after the technology train,
Steve

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