Ron,
Where are you first seeing this condition?
Is it on the bare boards?
Are the the assembler or fabricator?
How have you 'cleaned' these boards up in the past, if at all?
(cleaned or made the gold look better)
I'd like to offer whatever I can, your first message just did
not have enough information.
Franklin
Franklin, POD, & Paul
You say there are ways
to get around the Black Plague. Would you elaborate
please. Once
again I see messages where others are experiencing this
problem but no
absolute solutions. I have read the articles, tried the
erasers,
stronger fluxes, and pad scraping. No relief. I have learned
to
dislike Electroless Ni/ Immersion Au boards. I am thinking that HASL
or
precision pad technologies are much better. At least you can perform
your
soldering operation. A Circuit Card Assembly (CCA) with the Black
Plague
can run up scrap costs real fast. Not to mention the possibility
of late
shipment to the customer because of inability to solder. This is a
real
problem if you are using Ni/Au boards. So far there are few
comments and
the issue simply drops out of sight. Are
platers/fabricators not
controlling their processes or is this a inhouse
process issue. We have
checked our processes and find no
change.
Ron
Hollandsworth
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