In a message dated 10/28/99 7:42:49 PM Central Daylight Time, [log in to unmask] writes: > Guys, > > What stencil thicknesses are typically being used for MicroBGA's? > > What kind of solder paste height is considered to be enough for these > packages? > > Thanks > > > John Harris > > AEMS Pty Ltd > Hi John! At my past employer we had a 146-ball DSP micro-bga and I used a 4-mil stencil and had all the bigger stuff (50-mil) "solder paste compensated"... which means that the pads are actually overprinted a bit, this is to give you the volume back that you took away reducing the stencil thickness to print the micro-BGA good...it'll all wick back to the joints during reflow. Didn't have a way to measure the solder paste height, but it seemed to work good for me. Every board we built fired-up, and we didn't have a RMA...take it for what it's worth. Good starting point anyway... -Steve Gregory- ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################