In a message dated 10/07/99 15:13:22, [log in to unmask] writes: >We have sporadic problems with the copper level rising in our solder pot. >We reduce the temp and dross each morning. Could you recommend a specific >PM program to keep our SnPb clean? We believe per the certicates of analyses >that our supplier gives us good product. Any other reasons it might rise? >Green Hi 'Green,' Of course there is a reason that your Cu level in your solder pot. soldering requires that the base metal you solder to (in your case copper) dissolves in the tin (for Sn-based solders). This causes the formation of the intermetallic layer(s) on your exposed Cu (indicating a good metallurgical bond) as well as some dragging-in of Cu into your pot. What you need to do periodically is to replace the content of your solder pot (it typically can be reclaimed at your supplier). If you do not do this, your HASLed solder will get significantly worse with time (depending on through-put). Werner Engelmaier Engelmaier Associates, L.C. Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach, FL 32174 USA Phone: 904-437-8747, Fax: 904-437-8737 E-mail: [log in to unmask], Website: www.engelmaier.com ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################