Hi Eric, Two thoughts; First, look at oxide and reducer baths. Could have floating debris that is becoming lodged between traces. Even if these pieces weren't originally metal they could become metalized through the oxide and subsequent conversion step. Second, and most obvious, would be to look for signs of over etch on cores which may be generating slivers of copper. If you're using 1 oz. copper this would be more of a problem than on thinner copper laminates. Escaping AOI is normal if they're smaller than your settings would pick up or the slivers are forming after AOI, say even during the press cycle itself. Good luck. Mark Mazzoli [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################