Check out _Electronic Packaging Materials and Their Properties_, by Pecht et
al, published by CRC Press. It shows it depends on resin fraction and varies
from 12-20 ppm/deg C in plane, and 60-80 ppm/deg C in the "z-axis". (Don't
forget the units...a lesson NASA recently re-learned the hard way!)
Hope that helps.

Timothy Reeves
ECD Circuit Board Division
13626 South Freeman Road
Mulino, OR 97042
[log in to unmask]
(503) 829-9108 (800) 228-8198  FAX (503) 829-5482



> ----------
> From:         John Brewer
> Sent:         Tuesday, October 5, 1999 10:16 AM
> Subject:      FR-4 Coeff of thermal expansion? Material Data?
>
> Can anyone point me to
>
> (specifically) coeff of thermal expansions for FR4
> (generally) material properties for same?
>
> Thanks!
> John
>

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