Hi Netters,

I've manufactured some naked die into flipchips by gold ball bumping them. They
are then assembled onto a board which has been stencil printed. I need to know
the pressure required to assemble the flipchip onto the substrate with the
paste. I'm using a pico-placer to place the flip-chip onto the substrate with a
programmable force applicator. The chip has 25 bumps which are in a periferal
formation. The minium pitch is 178 microns, with a minium gap of 68 microns. The
pad size is 111microns and the gold ball is 90 microns across and 35 microns in
height. The assembly is then to go through a reflow oven which is to be nitrogen
purged.

Thanks very much

Gareth Jones
Celestica

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