Hi Netters, I've manufactured some naked die into flipchips by gold ball bumping them. They are then assembled onto a board which has been stencil printed. I need to know the pressure required to assemble the flipchip onto the substrate with the paste. I'm using a pico-placer to place the flip-chip onto the substrate with a programmable force applicator. The chip has 25 bumps which are in a periferal formation. The minium pitch is 178 microns, with a minium gap of 68 microns. The pad size is 111microns and the gold ball is 90 microns across and 35 microns in height. The assembly is then to go through a reflow oven which is to be nitrogen purged. Thanks very much Gareth Jones Celestica ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################