Hi, We're designing boards that will use both solderable (BGA and QFP) components and wirebonded die (that need gold bond pads). It also looks like the QFPs will be on the backside of the board in the "shadow" of the BGA topside component. I would appreciate any advice on: (1) recommended surface finish on the board (2) component placement guidelines Thanks, Terri ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################