ONLY THE SMALL SURVIVE! ...especially when it comes to printed wiring boards. Explore the material, design and processing alternatives that have already begun revolutionizing substrate technology at IPC's 4th Annual National Conference on High Density Interconnect Structures (HDIS) "Solutions for Ultra-High Density PWBs" November 18-19, 1999 Renaissance Austin Hotel, Austin, TX With Workshops on November 17, 1999: -HDI Design and Data Transfer -Fabricating Advanced PWBs Using Build-Up Technologies -High Performance, High Density Base Material Alternatives to FR-4 -Lasers in PCB Manufacture APPLYING MOORE'S LAW TO PRINTED CIRCUITS is not as farfetched as you might think. Can the industry double or quadruple conductor, vias and land/pad density every year or two, thus emulating Gordon Moore's famous prediction for transistors on a bare die? More importantly, for those involved in HDI manufacturing: Will they need Moore's law? Will the OEMs provide their suppliers with the economic motivation necessary to drive the technology forward and production costs down? IPC's Fourth Annual National Conference on High Density Interconnect Structures (HDIS) will explore these questions and provide a comprehensive look into the future of substrate technology. Along with OEM requirements, new dielectric materials, fabrication processes, reliability testing and HDI standardization efforts will be covered in the two-day technical conference. Wednesday workshops on material alternatives, build-up processes, laser technologies and design for HDI will bring you up to speed on all current options and manufacturing practices. This conference will provide all the evidence you need to understand that in the world of portable, consumer electronics "only the small survive!" For a full conference brochure and registration information, visit the calendar of events on our website at www.ipc.org or contact Leslie Zaitz at 847/790-5329 or by e-mail at [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################