Yuan, try Mr. Kim Blackwell at the IBM Endicott site. Email is [log in to unmask] The main phone number is (607) 755-0123. Good luck. > ---------- > From: LI YUAN[SMTP:[log in to unmask]] > Sent: Wednesday, October 13, 1999 4:55 PM > To: TechNet E-Mail Forum.; Houston, Terri > Subject: Re: [TN] IBM substrate for BGAS > > Someone from IBM contacted me on this substrate but I forgot getting his > number. Would you please give me a call @ (408)544-7508? > > Sorry for bothering others. > > Yuan Li > > > On Fri, 1 Oct 1999, Houston, Terri wrote: > > > Hi Yuan, try: > > http://www.chips.ibm.com/products/interconnect/documents/pks037400.pdf > > > > > ---------- > > > From: LI YUAN[SMTP:[log in to unmask]] > > > Reply To: TechNet E-Mail Forum.;LI YUAN > > > Sent: Friday, October 01, 1999 1:43 PM > > > To: [log in to unmask] > > > Subject: [TN] IBM substrate for BGA > > > > > > Good Friday, > > > > > > I am not be able to get through to the Technet from my email account > at > > > the company, so i am using my old account at school. We are constantly > > > looking at substrate technologies in our company. I came across one > > > article in a recent issue of Semiconductor International which has > > > information on an IBM substrate from IBM Microelectronics: "IBM > > > Interconnect Products recently introduced an organic substrate, > > > called a high-performance chip carrier (HPCC), with a CTE of > 12x10-6/K. It > > > has a closer match to silicon than most organic-based substrate > materials" > > > > > > Do anyone know where to find more information? You can contact me @ > > > 408-544-7508 if you want. > > > > > > Thanks, > > > > > > > > > Yuan Li > > > > > > ############################################################## > > > TechNet Mail List provided as a free service by IPC using LISTSERV > 1.8c > > > ############################################################## > > > To subscribe/unsubscribe, send a message to [log in to unmask] with > > > following text in > > > the body: > > > To subscribe: SUBSCRIBE TECHNET <your full name> > > > To unsubscribe: SIGNOFF TECHNET > > > ############################################################## > > > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > > > additional > > > information. > > > If you need assistance - contact Gayatri Sardeshpande at > [log in to unmask] or > > > 847-509-9700 ext.5365 > > > ############################################################## > > > > > > > ############################################################## > > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > > ############################################################## > > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > > the body: > > To subscribe: SUBSCRIBE TECHNET <your full name> > > To unsubscribe: SIGNOFF TECHNET > > ############################################################## > > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > > information. > > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] > or > > 847-509-9700 ext.5365 > > ############################################################## > > > > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################