I am currently having an issue with blowholes on TH components. What I have concluded is that the components are too tight and sit flush against the top of the board. When they go through wave solder, the outgassing has no way to go but down towards the wave solder. We have tried loosening up components but then we incurr having the LED's uneven after wave solder (and the LED's do not match up to the corresponding window in the enclosure) and are currently looking for an alternate LED that has standoffs so that the plated barrel is not sealed at the top. My question is: Is there anything that can be done process wise to reduce this defect? Thanks to all for your input Ivan Barrios ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################