I am currently having an issue with blowholes on TH components. What I have
concluded is that the components are too tight and sit flush against the top of
the board. When they go through wave solder, the outgassing has no way to go but
down towards the wave solder. We have tried loosening up components but then we
incurr having the LED's uneven after wave solder (and the LED's do not match up
to the corresponding window in the enclosure) and are currently looking for an
alternate LED that has standoffs so that the plated barrel is not sealed at the
top. My question is: Is there anything that can be done process wise to reduce
this defect? Thanks to all for your input

Ivan Barrios

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