Susan, As the others have stated, it is highly unlikely that the adhesive changed states and flowed into the crack region of the component. I have experienced the anomaly that you describe. The root cause was excessive down force during placement of the component onto the PCB (one of the PCB supports was not properly installed into the tooling plate and caused the board to bow up). During the subsequent cure process, the adhesive flowed into the crack of the component and visually covered the crack (a double dot of adhesive was used). During ICT, a high resistance measurement flagged the component and upon removal, the crack was found. Steve Sauer Mfg. Engineer Xetron Corporation ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################