TechNetter,
 I want to use microsection to check interconection defect (ICD). But I have
no standard procedure to verify this defect. Should I use microetching on
microsection coupon? Will microetching cause confuse between ICD and normal
interface between electro'less copper and inner layer copper? Is there any
standard procedure to do microetching? Any input I will be very appreciated.

Howard Lin

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