TechNetter, I want to use microsection to check interconection defect (ICD). But I have no standard procedure to verify this defect. Should I use microetching on microsection coupon? Will microetching cause confuse between ICD and normal interface between electro'less copper and inner layer copper? Is there any standard procedure to do microetching? Any input I will be very appreciated. Howard Lin ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################