Allen, Looking on page 121 of your 610 10.2.6 Round or Flattened leads Maximum Heel fillet height is Dim E Dim E is on page122 Get back to me if needed Hope this is it and it helps Nancy >>> "Kluz, Allen E." <[log in to unmask]> 09/17/99 02:28PM >>> This is on the top side of the pcb, using a surface mount part. I have the '94 IPC 610 book, looking on pg. 123, under SMT assy. Sorry, your drawing doesn't help for my application. > -----Original Message----- > From: Nancy Trumbull [SMTP:[log in to unmask]] > Sent: Friday, September 17, 1999 11:19 AM > To: [log in to unmask] > Subject: Re: [TN] maximum solder joint thickness > > Hi Allen, > I would like to help you but I'm not sure about your question. > Please give a little more information. > 1. What side of the PCB > 2. Plated through or not > 3. Joint = Solder thickness yes > 4. What page are you looking on > > Your question is how thick can the solder be from the pad to > the lead. > Please open the attachment and let me know if this is what your > are asking. > Jack Crawford will know I'm sure > Or e-mail me > [log in to unmask] > > Nancy > >>> "Kluz, Allen E." <[log in to unmask]> 09/17/99 10:42AM >>> > Technetters, > I've been searching through the IPC-A-610: Acceptability of Electronic > Assemblies Guidelines, and can't find anything on guidelines for maximum > joint thickness (from the pad to the lead). The manual refers to as the > "G" > dimension, which clearly identifies the minimum thickness'. Does anyone > know of guideline for this and where it's stated? I'm looking for a round > lead in particular. > > Thanks in advance. > > > Allen Kluz > Supplier Quality Engineer > [log in to unmask] > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or > 847-509-9700 ext.5365 > ############################################################## > << File: Joint.doc >> ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################