----- Original Message -----
Sent: Wednesday, September 01, 1999 10:18
PM
Subject: [TN] BGA site preparation after
parts removal.
Bonjour Everybody,
I am actually facing a problem when I am
performing BGA repairs on boards. The problem is the following:
- The solder mask surounding the BGA pads is
removed while we are removing the solder residues after parts was taken off
it's location. The way we are preparing the site is the following: We are
depositing paste soldering flux over the area to rework and then with the
use of a soldering iron and a desoldering braid we remove the solder. We are
trying not to scratch the board with the desoldering braid and keep the iron
tip temperature at the minimum workable temperature. After the completion of
that cycle we are cleaning gently the board to remove excess of burnt flux.
Is there any other known good method about how to prepare the BGA site
before installing a BGA at the same site again ? (Note: the one using
Bismuth alloy is not aceptable for us...)
I am waiting anxiously for an answer so please contact me
about this topic. Thanks !
Best Regards
Mario Dion