Hi Vincent,
We used to wavesolder 3.2mm 18"x12" boards at my previous contract manufacturing employer. The high thermal absorption of
groundplane layers makes life interesting...
I ensured a good immersion depth in the wave (almost 100% of pcb thickness), and a long,slow, thorough preheat prior to that. We
were using no-clean flux, but no nitrogen. We achieved 50-75% fill in some areas of the board, 100% in others. I also had the pcb
redesigned with a marginally larger hole to lead ratio, and wider vias on the next board revision which further improved matters.

Regards,

Justin Braime
Process Engineer - Compuspec Industries
1a Niall Burgess Rd, Mt Wellington
Auckland, New Zealand
[log in to unmask]
www.compuspec.com
Ph: +64-9-574 1990
Fax: +64-9-574 1988

----- Original Message -----
From: Vincent BADA
To: [log in to unmask]
Sent: Thursday, September 30, 1999 6:32 PM
Subject: [TN] Wave soldering


Hi all,

What is the minimum vertical fill of solder for plated through holes ?

We have some problems to obtain the 75% requested by IPC-A-610 for a class 2
board.
In fact, the board has a thickness of 3,2 mm.
We use a no-clean flux and the wave is under nitrogen.

Is there any special criteria regarding to the thickness of the board ?
Has anyone succeeded in obtaining a correct solder filet for thick boards ?

Thanks,

Vincent Bada
Process Engineer
Alcatel Etca
Charleroi
Belgium

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