Rather than send out multiple messages: 1) COB, etc.: There is a book that is relatively up to date: "Flip Chip Technologies" edited by John Lau. There is much activity on flip-chip, so I'd look up the more current literature if it's important to you. You might peruse the http://www.ieee.org/conferences/tag/tag.html web site and choose Packaging. If your in a city with a good (very major) university (I am not), your library is the best bet. 2) Plasma clean/IC's: don't proceed until you talk with someone with first hand experience and deep knowledge. You can trash your chips. 3) Wire bonding: A rough surface (e.g., spiked) will just "moosh" (for lack of a better term) all around. Surface cleanliness depends on how you clean your surface and the residue it leaves behind. Water and oxides will always be present (except Au oxide is unstable at room temperature). Thin films and interfaces can be extremely strong. The strength of thin films can be 1000X higher than bulk equivalents and their other properties (e.g., electrical) vary as well with thickness. Auger (pronounced o-jay (a french "je") for you non-surface scientists) is useful because it can easily explore the composition of the top 500-3000 angstroms (it's accuracy is about 50 A). But you pay $150/hr (one way or another in a big company). But that's only for gross contamination during film deposition (plating or sputtering). Also, AES (another way to say Auger) is not useful on rough surfaces because you can't tell it's depth from the surface. About solving this for you, I don't think I can from here. Yes, I'm a thin film metallurgist (presently looking for some work in Portland in this field if any of you have connections), but the problem you have is very equipment/metal-system dependent. It's like long distance surgury. I am available as a consultant (but I get expensive), but first I recommend calling your suppliers and trying to network through them to find an industrial partner (nearby) that you can visit and get ideas. Serious problems are not solved in a day or even a week (which many of my clients loath to hear). Carey -----Original Message----- From: Nicholas LAI <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Date: Monday, September 27, 1999 12:20 AM Subject: [TN] COB,FP,TAB >Hello... >There is some terms I want to know. COB, FP,TAB? > >Can anyone provide some info to me.. or related web sites.... > >Best Regard,, >Nicholas Lai >9/27/99 > >############################################################## >TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c >############################################################## >To subscribe/unsubscribe, send a message to [log in to unmask] with following text in >the body: >To subscribe: SUBSCRIBE TECHNET <your full name> >To unsubscribe: SIGNOFF TECHNET >############################################################## >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information. >If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or >847-509-9700 ext.5365 >############################################################## > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################