Hi all, Can anybody tell me what the typical forces are involved for Gold stud bumping using ultrasonic (A typical 80 micron gold bump). Furthermore what would be the typical frequency or power of the transducer system? Once a Gold bump is formed what would be the typical forces experienced when coining the bumps. Is there a risk of cracking the die? Thanks very much Gareth Jones Celestica Ltd ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################