Hi all,

Can anybody tell me what the typical forces are involved for Gold stud bumping
using ultrasonic (A typical 80 micron gold bump). Furthermore what would be the
typical frequency or power of the transducer system?

Once a Gold bump is formed what would be the typical forces experienced when
coining the bumps. Is there a risk of cracking the die?


Thanks very much

Gareth Jones
Celestica Ltd

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