Hello All, This is a question for all you board assemblers out there, I originally sent to this message to the Designer Council list, so I apologise in advance to anyone who subscribes to both forums. All the data I have regarding pad sizes (e.g. IPC-2221 9.1.1) give examples on how to calculate Minimum pad sizes, usually from a PCB fabrication standpoint. IPC-2221 states that all lands and annular ring shall maximised wherever feasible, consistent with good design requirements and electrical clearance requirements. My questions are: How do I determine the pad size that will give me the best soldered joint? Would the minimum pad size calculated by the formula in section 9.1.1 still provide a good soldered connection? Are there upper limits to the size of a solderable surface of a pad? Would the Ideal be to maximise all the pad sizes to one size that meets the requirements of 9.1.1 for all holes? I am surprised there is no reference to soldering in the standard relating to pad sizes, I am sure the pad size must have some effect on the solder fillet. Any information would be appreciated, Thanks in advance, Mark ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################