I am looking for some informations about electrical through hole component (THC) solderability. Actually, some problems occur when we have to solder a component on a multilayer printed card. We are faced to the problem when 3 ground layers at least are connected to the component hole. Some finite element simulations of the problem have revealed that the following parameters are very influent: - Thermal capacity of the component - Lead material of the component - Number of connected ground layers to the component hole - Layers position - Boundary conditions I am looking for some reference, specifications and/or test results about it. Thank you Bertrand DESSART Thermal and Mechanical department ALCATEL ETCA Charleroi BELGIUM ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################