can you use dry nitrogen to bake out? At 04:13 PM 9/14/99 -0500, you wrote: >Al, >Those are old parts. Hmmm. Although weight loss studies I have done and >have seen from vendors show most of the moisture leaves components within >the first four hours, these investigations have not been with parts that >have had the possibility to suck up moisture for five years. (Well they >wouldn't be doing it continuously.) I personally would be a whole lot more >comfortable with a 24 hour temperature soak, at the temperature you >mentioned. I would expect that at this temperature you should be OK with >respect to growth of surface oxide, unless of course you are right on the >hairy edge of your pass/fail criteria for solderability. I would also be >inclined to use them as soon as possible after they come out of the oven, as >I have no idea how susceptible the particular SOICs you have are to moisture >pick-up. > >regards, >Bev Christian >Nortel Networks > > >> -----Original Message----- >> From: Alan Shaw [SMTP:[log in to unmask]] >> Sent: Tuesday, September 14, 1999 4:34 PM >> To: [log in to unmask] >> Subject: [TN] Baking SOIC packages to dry them prior to reflow solder >> >> I have 5 year old plastic SOIC packages on reels and want to dry them out >> in >> an oven rather than leave it to the pre-heat of the reflow solder machine. >> Production asked for temperature and time for the SOIC to be in the oven. >> My initial thoughts are to put them in a cold oven and set the thermostat >> to >> 110'C and leave them baking for 4 hours. Then turn off the oven. Remove >> them >> when cool and use in the insertion machines the next day. >> Is the temperature and time suitable? >> >> The leads have passed a solderability test already, would the time in the >> oven have a significant effect on solderabitiy? >> >> Al Shaw >> ashaw at napcosecurity dot com >> >> ############################################################## >> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c >> ############################################################## >> To subscribe/unsubscribe, send a message to [log in to unmask] with >> following text in >> the body: >> To subscribe: SUBSCRIBE TECHNET <your full name> >> To unsubscribe: SIGNOFF TECHNET >> ############################################################## >> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for >> additional >> information. >> If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or >> 847-509-9700 ext.5365 >> ############################################################## > >############################################################## >TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c >############################################################## >To subscribe/unsubscribe, send a message to [log in to unmask] with following text in >the body: >To subscribe: SUBSCRIBE TECHNET <your full name> >To unsubscribe: SIGNOFF TECHNET >############################################################## >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information. >If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or >847-509-9700 ext.5365 >############################################################## > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################