We are looking at current trends in 0402 land patterns and effects on tombstoning. This will result in a DOE incorporating the current varieties of existing designs to improve post-reflow quality levels. It will also incorporate various surface finishes and stencil modifications. I would like feedback on any types of pad layouts (and stencil design) we have not yet considered, to allow incorporation into the DOE. We are currently looking at following land patterns: - IPC Standard Layout - SMT Plus Layout - Siemens Inverted Horseshoe - Round Pads (Layout TBD) Any help that could be offered (either via TechNet or offlline) would be greatly appreciated, including references to studies previously conducted.... Mike McMonagle PCA Process Engineering Supervisor K*Tec Electronics 1111 Gillingham Lane Sugar Land, TX 77478 (281) 243-5639 Phone (281) 243-5539 Fax [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################