Bertrand - If I understand your problem correctly, it would seem that you are dealing with a situation where the three internal layers of copper are heat sinking the plated thru hole and preventing complete solder flow thru during the wave soldering process. We use an attachment configuration for internal planes and heavy conductors which we call an "isotherm". This is simply a thermal break which surrounds the internal circuit pad forming a structure somewhat like a wagon wheel. We have several configurations of this form which allow connection of ~30 to 60% of the internal pad to the surrounding circuit or plane area. Hope this helps - regards - Kelly ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################