Hi Rick - When your solder past reflows, it will be scavenged by the via leaving you with a starved solder connection, if you have any solder connection at all. You will also develop some quantity of solder globules on the the opposite side of the board. I've seen a couple of cases where the surface tension and gravity effects were sufficient to consume a portion of the balls under the BGA itself. This problem with vias in pads has been pretty well known since the early days of SMT. Only a blind via or microvia in pad will avoid the problem. This is another reason why most of the BGA suppliers provide some pretty good guidance for designing and hooking up their devices. Wish I could suggest a solution, but I just don't have one. Good luck - Kelly ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################