Dear all, All the data I have regarding pad sizes (e.g. IPC-2221 9.1.1) give examples on how to calculate Minimum pad sizes, usually from a PCB fabrication standpoint. IPC-2221 states that all lands and annular ring shall maximised wherever feasible, consistent with good design requirements and electrical clearance requirements. My questions are: How do I determine the pad size that will give me the best soldered joint? Would the minimum pad size calculated by the formula in section 9.1.1 still provide a good soldered connection? Are there upper limits to the size of a solderable surface of a pad? Would the Ideal be to maximise all the pad sizes to one size that meets the requirements of 9.1.1 for all holes? I am surprised there is no reference to soldering in the standard relating to pad sizes, I am sure the pad size must have some effect on the solder fillet. Thanks in advance, Mark