Dear collegues, When producing strip-line boards with Nickle/Hard-gold as etch-resist, it is a well known problem that the hydrogen generation in the plating baths can sometimes cause lifting of the photoresist. This results in plating of nickle and/or gold under the resist. Some tricks are known ( or at least told ) to minimize the problem, e,g, baking or UV bumping prior plating and reducing current densities. Still, I find the proces far to unpredictable and am thefore seeking advise on this problem. Does brand of photoresist make a difference?. Several plating houses have had best experiences with a product from german 'Hoechst', but this is not available anymore. We are using sub-contractors for the plating proces, but apply the plating resist ourselves. Sorry if this problem has been on this forum resently, but perhaps new information is available today?.... regards Torben Østeraa tech. mgr. Printca AS Denmark ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################