Apart from all thinks suggested (humidity ; large copper grounds, etc.) ; what gave us the worst on this line was undercured (UV) LIQUID PHOTO . Apparently speeding the process or underpowered lamps can leave top dry and on copper contact not so . Than reflow measled it all . No idea if baking does influence this scenario (never bothered) : Did as Bev did afterwards . Not that you would have this luxurious options , as I remember when I've had a sub shop ; you take what you get, say yes sir and do (not look) your best. This Nortel fellows bake on sunshine comforts forgetting mere mortals sometimes . Paul Klasek ResMed -----Original Message----- From: Stephen R. Gregory [mailto:[log in to unmask]] Sent: Tuesday, 31 August 1999 6:37 To: [log in to unmask] Subject: [TN] Delamination and Blisters after Wave, a follow-up... Hi ya'll! Well, I waved a dozen more of the boards that blistered on me Saturday. This time I "baby-sat" the boards from baking to wave. I baked them at 125º C. for 3-hours, and waved them within 2-hours after baking...no blisters this time. They were the same datecode as the ones that blistered on Saturday (9915) and even a few of them had a 9831 datecode...but nada blisters. I used the exact same profile I used Saturday when I waved em' too... Hmmmmmm... I've got a digital camera and if anyone wants to see the blisters I got on Saturday, I can send ya' a picture. From the responses I got from a number of people and from a lot of the messages I read in the archives on this subject, if I were a betting man, I woulda bet that the boards would have blistered on me today...but they didn't... -Steve "Guess I'll bake more often now..." Gregory- ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################