Rudy, I'd like to hear more about this "oxide" you're using. Seems we're still having a rough time with s-m adhesion after immersion "white tin". I learned from TechNet that an adhesion promoter would benefit us; however, I have yet to find something compatible. Any help would be appreciated, thanks Franklin ps: We have switched from Electra to Coates on recommendations, has anyone had worse or better luck with them (Coates)? -----Original Message----- From: Rudy Sedlak <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Date: Wednesday, August 25, 1999 5:31 PM Subject: Re: [TN] Dry Film Soldermask Adhesion.. Steve: You finally asked something that I can answer! Thanks! The problem of adhesion of Dryfilm soldermask to bare Copper is a legend, and it is NOT your cleaner, almost certainly. Dryfilm soldermask does not adhere to Copper well. H-P (remember them, they used to make PCB's) had an especially, ahh, "interesting" test for soldermask adhesion, where they floated the board on molten solder for 1250 hours, or some such, and no sort of cleaning could get them through the test....and they further said that essentially all cleaning gave the same results, whether chemical, or mechanical abraision. However, oxide made the soldermask stick so strongly that you had to destroy the mask to get it off..... So, we formulated an oxide chemistry for them that they sprayed on, that was SO light you could not see it. We got to calling it the "Emporer's Oxide", as only the faithful could see it!!!! They had some non-believers (at H-P) that at one point, removed panels from the oxide line, and put soldermask on them to see if they could tell a difference between panels that had been run through the oxide line, or not. THERE WAS, BIG TIME. This is a bit extreme, to consider oxide under soldermask, but it do work, and is the best possible bond enhancer. Hope this helps, in some way. Best, Rudy Sedlak RD Chemical Company ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################