Hi Paul, and others, I have never worked with Sn96, let alone in connection with Au-plated Ni. I was involved however in the IEEE CLTF (Compliant Lead Task Force) when Ag-plated leads caused components to pop off PCBs (solder was near-eutectic SnPb). We never did determine whether there is a critical Ag concentration, similar to the 4% Au number that is bandied about. The culprit, as with Au, were AgSn IMCs. All IMCs are brittle, most of them are strong except AuxSny and AgxSny, which seem to be weak to boot. Further, some of these (Au, Ag) IMCs come in geometries (platelets) that also result in weak intergranular bonds. It stands to reason, that these IMCs would behave similarly in Sn96. I do not know what, if any, interactions would come from having both AuxSny and AgxSny IMCs present, particularly in concentrations above the oft quoted 4%. I do share your concern. Werner Engelmaier Engelmaier Associates, L.C. Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach, FL 32174 USA Phone: 904-437-8747, Fax: 904-437-8737 E-mail: [log in to unmask], Website: www.engelmaier.com ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################