Are you talking about weave impressions left from low resin to glass ratio
materials? If you are, the answer is get away from using that nasty old
7628/7629 material facing foil. Go resin rich for no weave impressions and
better innerlaminar bond strength with better resist adherence.

Earl Moon
----- Original Message -----
From: Anne Ledger <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, August 17, 1999 5:45 AM
Subject: [TN] Innerlayer issue


> Good Morning Technetters,
>
> I have a question for board fabbers.  Problem:  We are experiencing
> weave texture on our innerlayer material.  I have spoken to the
> manufacturer who states that weave does shift in the "pour" of the
> material (when the resin is added) and that there is no specification
> that controls the depth requirement of the weave.  The topography is
> visual prior to lam/image.  The condition is causing our resist to lift
> slightly and allows an etch stain on the double treat foil that so far
> we can not remove.  Question:  Is this a typical condition of innerlayer
> material (other manufacturers)?  Is it double treat foil only?  Is there
> a way to remove this type of etch stain?  What is the acceptablity of
> stain on inner layer foil?  I can't find any reference info in IPC.
>
> Any and all input would be appreciated.
>
> Anne Ledger
> EMDS, Inc.
>
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