Good Morning Technetters, I have a question for board fabbers. Problem: We are experiencing weave texture on our innerlayer material. I have spoken to the manufacturer who states that weave does shift in the "pour" of the material (when the resin is added) and that there is no specification that controls the depth requirement of the weave. The topography is visual prior to lam/image. The condition is causing our resist to lift slightly and allows an etch stain on the double treat foil that so far we can not remove. Question: Is this a typical condition of innerlayer material (other manufacturers)? Is it double treat foil only? Is there a way to remove this type of etch stain? What is the acceptablity of stain on inner layer foil? I can't find any reference info in IPC. Any and all input would be appreciated. Anne Ledger EMDS, Inc. ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################