Date: Thu, 26 Aug 1999 06:54:00 EST From: Jim Marsico 516-595-5879 <[log in to unmask]> Subject: RE: [TN] temperature profiling for BGAs To: TechNet <[log in to unmask]> MIME-version: 1.0 Content-type: TEXT/PLAIN; CHARSET=US-ASCII Posting-date: Thu, 26 Aug 1999 07:03:00 EST Importance: normal A1-type: MAIL The best way to develop your oven parameters is to install a thermocouple through the bottom of the board which protrudes the top directly into a solder joint. You can attach it with a thermal epoxy or try soldering it with a high temp solder. There is, however, at least one component manufacturer that I know of who recommends attaching the thermocouple onto the top of the component. (I know, a lot of you will disagree...) They claim that the temperature differential will stabilize eventually.