Date: Thu, 26 Aug 1999 06:54:00 EST
From: Jim Marsico 516-595-5879 <[log in to unmask]>
Subject: RE: [TN] temperature profiling for BGAs
To: TechNet <[log in to unmask]>
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Posting-date: Thu, 26 Aug 1999 07:03:00 EST
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The best way to develop your oven parameters is to install a thermocouple
through the bottom of the board which protrudes the top directly into a solder
joint.  You can attach it with a thermal epoxy or try soldering it with a high
temp solder.  There is, however, at least one component manufacturer that I
know of who recommends attaching the thermocouple onto the top of the
component.  (I know, a lot of you will disagree...) They claim that the
temperature differential will stabilize eventually.