Hello people; We have a new process to be implemented on our 600 mil DIPs w/c is solder dip them using 63/37 solder after component preparation (shear and splay). Need to know more on standard or the criteria for: 1. Solderability 2. Wetting 3. De-wetting 4. Flux residue 5. STD plating thickness and composition Thanks. Your valuable inputs are highly appreciated. Eric ______________________________________________________ Get Your Private, Free Email at http://www.hotmail.com ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################