Since higher processing temperatures are needed with some of the new alloys, I thought some would find this announcement of interest. Regards Dave Bergman, IPC >>> "Joan Pecht" <[log in to unmask]> 08/03/99 03:40PM >>> Course Announcement: How to Select and Use Electronic Parts Outside the Manufacturer-Specified Temperature Range Held on: October 11, 1999 Held at: CALCE Electronic Products and Systems Center University of Maryland, College Park Instructors: Dr. Michael Pecht, Professor and Director, CALCE EPSC and Industry specialists For more details please visit: http://www.calce.umd.edu/general/course/coursum.htm Course Outline Several industries, including avionics, automotive, military, and telecommunication are facing problems with obtaining electronic parts rated for the temperature ranges required for operation. Legacy parts rated for extended (e.g., military, industrial, automotive) temperature ranges are being discontinued by semiconductor manufacturers. In addition, more advanced and affordable (e.g., low voltage, low power) functionalities are being introduced, but only for narrower temperature ranges. To stay competitive, both technically and economically, industries may need to consider using parts whose data sheet temperature limits are not broad enough to meet the application environment. Uprating is a process to assess the ability of a part to meet the functionality and performance requirements of the application in which the part is used outside the manufacturers' specification range. This short course will introduce the participants to the design, assembly, test, legal and cost issues related to uprating and use of uprated parts. Program Outline Taught By: Michael G. Pecht, University of Maryland 8:00 Opening: Introduction to uprating Taught By: Raymond B. Biaginni, McKenna and Cuneo LLP. (Law firm specializing in product liability) 9:00 Legal risks and risk mitigation methods Product liability theories Basics of a plaintiff's product liability case Strict liability Negligence Failure to warn Who's at risk - three categories of increasing risk Pass-through of electronic parts Modifications and alterations, but no change to basic function Use of parts outside environments specified by manufacturers Preventative measures to maximize key defenses Government contractor defense Contract specification defense Other significant defenses 10:30 Break Taught by: Michael G. Pecht, University of Maryland 10:45 Technical risks and risk mitigation methods Integration with part selection and management Consideration of alternatives Consideration of system level uncertainties Following best known practices Obtaining and interpreting part information accurately Risk mitigation is electrical testing Ensuring appropriate electrical test coverage Determining and accounting for electrical parameter variations Minimizing damage from part handling and testing Maintaining proper documentation Risk mitigation across supply chain Part manufacturer Distributor Contract manufacturer Test laboratory Customer Assessing part reliability at extended temperature Tracking and evaluating effects of technology trends 12:00 Lunch 1:00 Methods of uprating and definitions Parameter conformance assessment Parameter re-characterization Stress balancing How to assure quality of incoming parts When to re-uprate Taught by: Chris Wilkinson, Smiths Industries 2:30 Break Taught by: Representative of Bell Technologies (Test Laboratory) 2:45 Which parts can and cannot be uprated What does the future hold? 3:45 The economics of uprating Costs of uprating alternatives Non-recurring cost Recurring costs Future trends 4:30 Adjourn Michael Pecht is the Director of the CALCE Electronic Products and Systems Consortium (EPSC) at the University of Maryland and a Full Professor with a three way joint appointment in Systems Engineering, Mechanical Engineering, and Engineering Research. Dr. Pecht has a BS in Acoustics, a MS in Electrical Engineering and a MS and PhD in Engineering Mechanics from the University of Wisconsin. He is a Professional Engineer, an IEEE Fellow, an ASME Fellow and a Westinghouse Fellow. He has written eleven books on electronics product development. He served as chief editor of the IEEE Transactions on Reliability for eight years and on the advisory board of IEEE Spectrum. He is currently the chief editor for Microelectronics Reliability. He serves as an advisor for various companies and the U.S. government, providing expertise in strategic planning in the area of electronics products and systems development. Raymond B. Biagini is a partner in the Washington, D.C. office of McKenna & Cuneo, LLP. He joined the firm in 1980 and is a member of the firm's Management Committee. Mr. Biagini's practice focuses on product liability litigation, and he has substantial trial and litigation experience. As a leader of the firm's Product Liability/Toxic Tort Practice Group, he has defended manufacturers, system integrators, and component providers involving weapon systems, products made for civilian government agencies as well as consumer products. He also lectures and authors articles in the areas of products liability/toxic torts, and provides seminars on minimizing a manufacturer's product liability risks. Chris Wilkinson is a Principal Research Engineer in the Central Technical Department of Smiths Industries located at Cheltenham UK. He is undertaking research into the processes and procedures required to use commercial grade components in aerospace applications, the management of electronic component obsolescence and making process and procedure recommendations to the Aerospace Business units. He graduated in 1972 with a BSc (Hons) in Electronics from London University and joined GEC-Marconi as a junior engineer. Following periods with Racal (Slough) Ltd and Group 4 Total Security he joined Smiths Industries in 1979 as a hardware engineer working on Flight Control Systems. He moved to his present position in 1990, where he has undertaken near term hardware related research tasks. He is a Member of the Institution of Electrical Engineers. ################################################################ Leadfree E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE Leadfree <your full name> To unsubscribe: SIGNOFF Leadfree ################################################################ IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic Assemblies. 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