Matt, Just two hours oven for rigid-flex with rigid polyimide before HAL,are you sure? Edward > -----Original Message----- > From: Matthew Sanders [SMTP:[log in to unmask]] > Sent: β ιεμι 20 1999 6:26 > To: [log in to unmask] > Subject: Re: [TN] Rigid-Flex Board baking > > I do two hours at 125 C, and this seems to work fine (the oven is at 125 > when I put boards in). If that hasn't worked, it's usually been because of > lack of cleanliness of the copper surface prior to coverfilm lamination, > and > through working with my fab shops, we've been able to improve situations > like that. > > I'm also using the LF material for the coverfilm. The base is all > adhesiveless (and I've never been happier - yields are up dramatically > with > it), but we still have that acrylic for the coverfilm. Some on this list > have said they've had luck with other types of adhesive (epoxies and the > like), but I've never played with them. > > Hey, it's my first response to a question on Technet! I've been asking for > the past year, but I've never added anything myself. > > Matt > > Matthew Sanders > PCB/Metal Procurement Engineer, Trimble Navigation Ltd. > [log in to unmask] > Phone: (408) 481-7817 > Fax: (408) 481-8590 > > > -----Original Message----- > From: Steve R Mikell [mailto:[log in to unmask]] > Sent: Monday, July 19, 1999 2:14 PM > To: [log in to unmask] > Subject: Re: [TN] Rigid-Flex Board baking > > > Charles Barker asked > > ********************************************************************* > Charles Barker > 07/18/99 01:53 PM > > To: [log in to unmask] > cc: > > Subject: Board baking > > We are just getting into regular assembly of rigid-flex boards. What are > folks doing about removing the moisture absorbed in the flex? > > Is anyone using nitrogen as a drying agent? What are sources of > "dry-boxes" and such? > > All you flex makers out there, what do you recommend? > > TIA > > Charlie Barker > > ************************************************************************ > > Charlie, > > Its a Monday, so give us some time to get cranked up. First, are you > talking > old style or modern rigid-flex. > If you are using the old polyimide layers with acrylic adhesive, you can't > do > enough good things to guarantee success. > If, on the other hand, you are using the all polyimide construction, the > survivability is greatly enhanced. > > If your boards are pre-baked and sealed in moisture proof bags, you may be > able to process without a prebake. Moisture in your facility and time > "out > of > bag" will determine the need and severity of your bake. In cases like > these, > I always try and get any "scrappers" from the PWB fab house for > experiments. > 2 hours at 105 C would be a good starting point if baking proves > necessary. > > Good luck, > > Steve Mikell > Lead Ind. Eng. > Plant 13 > SCI Systems > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following > text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or > 847-509-9700 ext.5365 > ############################################################## > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or > 847-509-9700 ext.5365 > ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################