Dry film becomes soft with alkaline surface resulting poor bonding and
resist break down after solder plating.
Soak electroless copper panels in acidic solution and scrubb or rinse
well and dry. Any way surface should be acidic and rough. Some shops
using anti-tarnish after 2% acid soak and rinse
Thia is very common problem in lot of shops.
If it works , let me know.
Thankks,
Fulabhai Patel

CIPSA wrote:

>    Dear Sirs, The reason why we send this e-mail is because we are
> havingproblems of adherence of our dry film Dupont 4615.The problem
> always appears beside the track/pads, and in the final pcbyou always
> can see a bigger track, because the adherence of the film hasnot good
> and some Sn/Pb has get on the base copper (the film has notprotect
> correctly the base copper, beside the track). We have done the
> following corrective actions and there has not beenany success at
> all:1. We have increased the lamination temperature from 105 to
> 115ºC.The presion is about 4 bars. The lamination rolls speed is about
> 1,6-2 m/min.2. We have checked the pH of the revelator solution and
> goes from pH11 at the beginnig to 10,4 at the end of the solution
> live.3. We are quite sure that is not a electrolitic line problem,
> because in thesame bath position, we have panels with and without
> problems.4. We have checked all the insolation parameters and
> everything is OK. What we are doing now, is changing from Dupont film
> 4615, to 215.Maybe, it will solve the problem, but we don't know the
> cause of our problem. Does anybody knows the cause of our problem
> ??? Thank you in advance for your colaboration. Albert VaronQuality
> Manager.  **********************************************************
> CIRCUITOS IMPRESOS PROFESIONALES,S.A..
> Pol.Ind.Els Bellots C/de l'Aigua, 28
> 08227 TERRASSA (Barcelona) SPAIN
> Apdo. de correos 597-598
> Telf. 34.937856793 Fax 34.937861905
> **********************************************************