I appreciate you for your input Francis, The non uniformity I mentioned in my previous mail is within the same PR opening. The current ranges we use are in mAs and we plate at about 6 to 10 mA/cm2 thanks again, Yasmeen Francis Lai wrote: > nishath yasmeen wrote: > > > We are seeing non uniform plated copper deposits in very small areas on > > silicon wafers from the acid copper plating bath. > > > > I can understand the non uniformity across areas which are large ( > > inches) but these areas measure in micron range. The thickness profile > > of this area looks like a staircase on the profilometer. Is this a flow > > problem? Does this depend on the current density? > > What other factors do I need to consider for uniformity improvement? > > > > Any suggestions will be greatly appreciated. > > Thanks, > > Yasmeen > > > > ############################################################## > > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > > ############################################################## > > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in > > the body: > > To subscribe: SUBSCRIBE TECHNET <your full name> > > To unsubscribe: SIGNOFF TECHNET > > ############################################################## > > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > > information. > > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or > > 847-509-9700 ext.5365 > > ############################################################## > > Dear Yasmeen: > > I would regard your case as pattern plating. In pattern plating, the current densities > on each area vary. Smaller area will take more current and plate more while lager area > will take less current and plate less. I suggest you to use current density of 10 > mA/cm**2. If you are plating areas measuring in microns, you need a power supply which > can provide currents in mA for the acid plating bath. > > Please correct me if I am wrong!!!!! > > Francis > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information. > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or > 847-509-9700 ext.5365 > ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################