I THINK ITS TIME TO FIND ANOTHER FAB HOUSE "Tempea, Ioan" wrote: > Hi, > > now that the problem with the blistering solder mask is fixed ( we sent the > boards back since backing them was of no use), I have another one. > > Some of our assemblies have a high density of VIAs. On these products, > pretty often we get after wave some solder bubbles over the VIAs, some of > them exploded, like degassing. Since on some we see the same bubbling even > on the fiducials, I wonder if the humidity is the only one to blame, I even > wonder if there's any issue related to humidity at all. > > So, what could it be? Incompatibility between flux and solder sounds > possible? > > I would appreciate any input, > > Ioan