Hi, We've recently started receiving Texas Instruments C6701 DSP chips in a 352 pin BGA package with a large metal heat slug on the top. It appears the weight of the slug causes the balls to over collapse during reflow, increasing the amount of shorts we experience. Does anyone have any experience placing and reflowing this package? Any suggestions as to reflow profiles or other stuff I should look at would be appreciated. Thanks. Rick Thompson Ventura Electronics Assembly 2665A Park Center Dr. Simi Valley, CA 93065 +1 (805) 584-9858 voice +1 (805) 584-1529 fax [log in to unmask]