In a message dated 07/02/1999 12:31:46 PM US Eastern Standard Time,
[log in to unmask] writes:

> We have investigated the PCB fabricators process, the adhesive
>  curing process and the adhesive.  Does anyone have any advice?

And what were the results?  You describe a problem adhering to the mask.  The
SR1010 series is fairly porous and may absorb LOTS of stuff from the HASL
process.  My guess is that you have residual polyglycol residues on the
surface and absorbed into the near surface.  This changes the nature of the
mask.  Polyglycols are frequently used as surfactant agents and are
"slippery".

Doug Pauls
CSL