Dear colleague, The following is the schedule for the third day of the IPCWorks '99 conference. There have been updates made to the presentation for the first two days, which will be distributed to [log in to unmask] following this posting. I apologize for the delay in getting this update to you, but we have been experiencing problems with our e-mail server over the past week or so. Thank you for your patience and understanding. ---------------------------------------------------------------------- IPCWorks '99 Conference Schedule - Day 3 The following is the tentative schedule for the third day of the IPCWorks '99 conference, featuring an International Summit on Lead-Free Electronics Assemblies. Please note that the schedule could still change. If we do make any changes to the schedule, you will be informed. ********************************************************************** Wednesday, October 27, 1999 8:00 am - 12:00 pm PWB FINISHES Lucent's SnTech Process - Yun Zhang, Lucent Immersion Silver - A Big Win for the OEM, Fabricator and Mother Nature - Julie Fernanz, Intel Solderable Lead-Free Surface Finishes: Immersion Silver Performance Results - Don Cullen, MacDermid Rethinking the Importance of Reflow Atmospheres in the Lead Free Era - Andy Mackie, Praxair Rapid Deposition, High Build, Non-Electrolytic Tin for Use in the PWB Industry - Craig Bishop, McGean-Rohco Update of ITRI Electrloless Nickel/Immersion Gold (ENIG) Project - Bruce Houghton, Celestica Results of the CCAMTF Evaluation of Alternative Surface Finishes for Circuit Card Assemblies - Ronald Iman, Southwest Technology Consultants Design for the Environment Alternative Surface Finishes Project - Dipti Singh, EPA 1:30 pm - 5:00 pm BREAKOUT SESSION FOR THE DEVELOPMENT OF THE IPC ROADMAP FOR THE ELIMINATION OF LEAD IN ELECTRONICS ASSEMBLIES Now that you have had the opportunity to take part in the paper session and review the DTI report, "An Analysis of the Current Status of Lead-Free Soldering," you now have the opportunity to play a role in the development of the IPC Roadmap for the Elimination of Lead in Electronics Assemblies. Recognizing the need to catch up to the rest of the world, IPC is giving the industry the opportunity to take part in the development of the lead free roadmap. The roadmap will be developed during simultaneous breakout sessions divided into the following categories: Alloys Components PWB Finishes Reliability Processes Standards/Specifications Please note that only conference attendees will be able to take part in the roadmap breakout sessions. If you have not yet registered for IPCWorks, you can download the registration form at: http://www.ipc.org/html/IPCWorksreg.pdf Chris Jorgensen Technical Project Manager IPCWorks '99 Conference Coordinator An International Summit on Lead-Free Electronics Assemblies October 25 - 28, 1999 Hyatt Regency, Minneapolis, MN To stay on top of the lead elimination issue, subscribe to the [log in to unmask] e-mail forum. To subscribe compose the following email message: TO: [log in to unmask] SUBJECT: (leave blank) MESSAGE: subscribe leadfree YOUR NAME