I'm running a kit which requires placing 2 484 pin fine line BGA's(Altera-
1.00mmpitch, dimensions of the BGA is smaller than that of standard
256PBGA)  Upon inspecting the fabs, I noticed high number of vias that are
filled with solder. I am concerned about the high probability of solder
bridges upon reflow.  Any suggestions or input on how I should go about
doing it?

Tom