I'm running a kit which requires placing 2 484 pin fine line BGA's(Altera- 1.00mmpitch, dimensions of the BGA is smaller than that of standard 256PBGA) Upon inspecting the fabs, I noticed high number of vias that are filled with solder. I am concerned about the high probability of solder bridges upon reflow. Any suggestions or input on how I should go about doing it? Tom