Joe G Malley@MACDERMID 07/06/99 10:18 AM Francis, The comments made by Mssrs. Mok, Milad, and Holtzman in response to your inquiry all contain some valid points and should be investigated in order to check for possible improvements to your process. You did not specify if you are panel plating or pattern plating. This is important as you may be able to improve the design of your plating cell to achieve good uniformity on panel plating, but these same improvements may not be enough for pattern plating if you have some tough circuit designs (both areas of ground plane and isolated traces). I can make some specific suggestions for you if you could let me know: - Are you pattern plating or panel plating? - If pattern plating are you seeing differences from one design to the next or panel to panel on the same design? - What current density are you using? - What are the chemical concentrations of the bath (Cu, H2SO4, Cl) - What is the anode to cathode spacing? - What type of racks do you use? Top contacts? picture frame? center only with two panels going off to each side? A few suggestions in advance: - Make sure that the anodes are a few inches shorter than the depth of the cathode to minimize overplate on the bottom of the panel - Picture frame racks will give the best macrodistribution. - Check that the solution agitation is uniform - Be sure that the chemical constituents of the bath are at the proper concentrations. We can discuss all the particulars in more detail if you would call me. Alternately I can call you if you give me your contact information. I have tried this route before with you regarding other questions you have posted (reference my personal e-mails to you on 4/1, 4/2, 6/7, 6/8/99) but you have never responded to my e-mails. This is most frustrating to me Francis as customer service is an important priority to us at MacDermid and you are not taking advantage of this free service. Please give me a call or respond by e-mail. We have much experience with this system and I am sure we can help you to optimize your process. Best Regards, Joe Malley Research Project Manager MacDermid Inc. Phone: (203) 575-7921 Fax: (203) 575-7916 e-mail: [log in to unmask] Francis Lai <[log in to unmask]> on 07/04/99 02:25:08 PM Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to Francis Lai <[log in to unmask]> To: [log in to unmask] cc: (bcc: Joe G Malley/MacDermid/MACDERMID/US) Subject: [TN] Cu thickness varies from panel to panel Recently, I have found that Cu thickness plated onto panels may vary uo to 150 u inches from one panel to another under the same conditions and current and in the same bath. Did I do anything wrong? I am using a Macdermid acid plating bath 9241. My e-mail : [log in to unmask] THANKS!!!!!!!! Francis