Hi Technetters, I have a curious question to ask. Is there any specification state the amount of solder balls allowed on the bottom side or the side that undergo wave-soldering process. It is rather common to see solder balls formed in-between the leads of the connectors, or in-between the leads. However, is there any spec. to define the amount of balls allowable on the board. There are people used to remove the solder balls by brushing away - how about the spec ??? Poh ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################