All component manufacturer's that I work with have recommended profiles. Most have charts with maximum dwell time vs. temperature, maximum thermal shock entering the wave... Most of the larger commercial supplier's can supply you with a summary of experimental data for specific component types. Be careful, thermal shock performance varies by component type, size and supplier. Also, many solder machines on the market (especially used and bottome end equipment) are not capable of soldering some bottom side SMD components without exceeding reccomended thermal shock requirements. PCB warpage in wave soldering is largely determined by panel design and PCB fab processes. If a large ground plane is not symmetric across the whole panel, it will warp. But the main factor is the incoming PCB. If the laminate was flattened after HASL, for ex., wave processing may return the panel to its original condition. Hope this helps, Aric Parr Sr. Process Engineer Eaton Corporation 1400 S. Livernois PO Box 5020 Rochester Hills, MI 48308-5020 248 608 7780 [log in to unmask] ---------- Original Text ---------- From: C=US/A=INTERNET/DDA=ID/TechNet(a)IPC.ORG, on 7/16/99 9:31 AM: Hello. I am trying to get our approval for wave soldering on several space programs which are currently hand soldered. In doing so, I have been confronted with several questions. The main areas of concern for our folks are: 1. Does the wave solder process induce any thermal shock to the components or exceed the thermal spec's of the components? I realize that it will depend on the component and the wave temp, but does anyone know of papers, doe data, etc. that I can access and mount a convincing argument? 2. Will the wave solder process warp the PC board? Again, what I am looking for is hard data to marshal an argument. If so, how can we mitigate warpage? 3. For those companies that use page frames, do you wave solder with or without a it attached? Also, is a pre-bake recommended to remove moisture? If so, are there industry guidlines? I realize that this is a huge request, but I would appreciate any pointers, especially where to go to find the information. Eric Kalgren BFGoodrich Aerospace Data Systems Division (505) 938-5139 [log in to unmask] ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################