Hi Ioan Try drying/degassing for 2 hours at 120°C (or 80°C, evacuated) to remove the adsorbed moisture out of the laminate. Bernhard ---------- Von: Tempea, Ioan[SMTP:[log in to unmask]] Gesendet: Freitag, 9. Juli 1999 17:18 An: [log in to unmask] Betreff: [TN] PCB blistering during wave Fellow technetters, we are presently fighting with some ultra low-end TH only PCBs. During waving they blister a lot. We tried many things like hotter-colder preheating, hotter-colder solder temp, faster-slower speed. No result. Are there any other tricks to try, or we send them back to the fab? Thanks, Ioan