Folks, I am looking for a 'wave optimized' footprint for an RN-EXBV R-Pak. It is a 1206 style package with 8 'cup' style terminations. The footprint I have from my SMT Plus book is for paste, not wave, and I'm sure there are some differences to assure better solderability of these cups in the wave. TIA for any assistance.... Mike McMonagle PCA Process Engineering Supervisor K*Tec Electronics 1111 Gillingham Lane Sugar Land, TX 77478 (281) 243-5639 Phone (281) 243-5539 Fax [log in to unmask]