Hello Technetters:
  I would like to have a rough picture of the industry's current practice re
solderability testing.
  Anybody here who has adopted the Simulated Board Mounting Reflow
Solderability Testing (described in IPC's "Test S" of J-STD-002 and  procedure
"3" of EIA/JESD22-B102) as an alternative to the Dip&Look and  Wetting Balance
test for SMDs? Any concerns?
  Would appreciate your response.
  Regards,
  Lei Tumibay