Hello Technetters: I would like to have a rough picture of the industry's current practice re solderability testing. Anybody here who has adopted the Simulated Board Mounting Reflow Solderability Testing (described in IPC's "Test S" of J-STD-002 and procedure "3" of EIA/JESD22-B102) as an alternative to the Dip&Look and Wetting Balance test for SMDs? Any concerns? Would appreciate your response. Regards, Lei Tumibay